Polyimide  Development

In recent years, with the continuous shrinkage of front-end processes and reaching the apex of physical limitations, future 5G, high frequency, high speed and other related applications will continue to refine and advance. Therefore, advanced high-end packaging materials will be the basis for the growth momentum of semiconductor manufacturing processes moving forward, and polyimide will play a pivotal role in this.

Polyimide Applications

The PI products developed by Global Wings are diversified and customizable, and mainly used in the field of advanced semiconductor manufacturing and packaging as well as flat panel displays. providing customers with interlayer dielectric insulating layer materials for semiconductor manufacturing and packaging. We provide our customers with interlayer dielectric insulation materials for semiconductor manufacturing and packaging. The products are available in basic, negative and positive photoresist types, so Wings Global can adjust and customize the product type according to the needs of each customer.