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Chemistry

Polyimide  Development

In recent years, as front-end processes continue to shrink and approach physical limits, the advancement of future technologies like 5G, high frequency, and high-speed applications will persist. Advanced high-end packaging materials will drive the growth of semiconductor manufacturing processes, with polyimide playing a vital role.




Polyimide Applications

Wings Global's polyimide (PI) products are versatile and customizable, primarily utilized in advanced semiconductor manufacturing, packaging, and flat panel displays. We offer interlayer dielectric insulation materials tailored for semiconductor manufacturing and packaging, available in basic, negative, and positive photoresist types to meet each customer's specific needs.